时间：2013年6月14日(星期五)下午三点

地点：精仪系四楼4303房间

报告内容：3D Memory Architecture Overview

报告人：Dr. Er-XuanPing

Applied Materials, Inc.

Managing director in Silicon System Group

简历:

Dr. Er-Xuan Ping graduated fromIowaStateUniversityin 1995 with a Ph.D. degree in EE&CS department. He joined Applied Materials in April 2011 as a managing director in Silicon System Group Chief Technology Office responsible for strategy and product development in memory and novel materials. He was an engineering director at Sandisk for 3.5 years, and led material, process, process integration and device characterization teams to develop 3D RW technology in 4X and 2X nodes. Dr. Ping started his career at Micron Technology and spent 12.5 years as unit process development engineer, module technology leader, and thin film group manager. He holds 153 issued patents in the area of semiconductor memory.

报告摘要:

I will discuss various 3D memory architectures that will power the advanced semiconductors produced in leading memory fabs, that are facing scaling limits for existing memory technologies such as DRAM and NAND. Highlighting the device, integration and manufacturing challenges ahead as transition to new architecture, the discussion focuses on required material changes, the increased integration and manufacturing complexity, and the innovation to address the challenges in the semiconductor industry for the next decade. The equipment and techniques which enable highly controlled material interfaces and atomically precise thin film processing that are required in the manufacture of advanced devices will be discussed.

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2013年6月7日